NvisANA

NvA-OW300 is a world first in-line wafer organic non-visual defect detection system to prevent yield drop or wafer scraps by organic contamination in the semiconductor manufacturing Fabs.

It is a standalone and fully automated system with a built-in TD, CT and an integrated TOF-MS. And it supports FA and Host communication and it has its own auto calibration function and safety features for the in-line use not only Q-Labs application.

• ㆍFull Automatic Wafer handling, Sample preparation and TD-UCT-TOF Analysis
  ㆍTD-UCT-TOF integrated for IN-LINE application
  ㆍQuantitative measurement with Auto calibration using permeation tube
  ㆍFactory Automation and Host communication Support
  ㆍNo harmful Gas/Chemical is used.
  

• ㆍDetection limit : 1 ppt (1.0E7 atoms/cm^2)
  ㆍThroughput : 2 WPH
  ㆍOrganic residues on the wafer surface : CxFy, CxCly, CxFyClz, CxHyFz, CxHyClz and similar
  ㆍDetector : TOF
  

• ㆍMonitoring of residual by-product (CxFyHz) on the wafer surface or shallow bulk area After Etch Process
  ㆍCorrelation study of Organic residuals and Contact related defects such as contact not open and high contact resistance
  ㆍAnalysis on the effect of PR(PGMEA etc.) and Stripper (NMP etc.) residues on Oxidization GOI degradation, CVD charge to ㆍbreakdown degradation and photo haze defects.
  ㆍAMC analysis
  ㆍCorrelation study of Q-time and outgassing material